作為德國POINT ELECTRONIC  (PE) 公司中國區(qū)總代理，裕隆時代向用戶提供專業(yè)的的電子束吸收電流分析系統(tǒng)EBAC/RCI。

EBAC/RCI電子束吸收電流分析系統(tǒng)，能夠方便快速的定位半導體芯片電路中的短路及失效點位置，不但可以對同層電路，而且可以對次表層，甚至表層下第三層、第四層電路進行失效點的準確定位，因此能夠?qū)Π雽w芯片電路或相關(guān)材料進行快速準確的失效分析。

目前，集成電路芯片設(shè)計越來越復(fù)雜，關(guān)鍵尺寸和金屬連線線寬越來越小，傳統(tǒng)的失效點定位方法，如微光顯微鏡或光束又到電阻變化鞥，由于其分辨率不足，導致不能精確地定位電路故障點位置，電壓襯度方法雖然在一些開路短路失效分析中能快速地定位失效點，但只是局限于電路同層分析。

EBAC/RCI電子束吸收電流分析系統(tǒng)是基于掃描電鏡的分析系統(tǒng)，在保留掃描電鏡高分辨率的前提下，能夠?qū)ν瑢有酒娐愤M行高準確定位，同時能夠?qū)Υ伪韺由踔帘砻嫦碌谌?、第四層電路進行失效點定位，因此越來越多的應(yīng)用于先進制程芯片的失效分析。在涉及多層金屬層的失效定位分析時，EBAC/RCI方法更加簡便精確，可保證分析的成功率，并縮短分析周期。

EBAC/RCI acquisition

The lowest noise Electron Beam Absorbed Current (EBAC)
and Resistive Contrast Imaging (RCI)   

Find exact location of any open,resistive or shorting defect
 

• Localize metal line cuts caused by cracking,corrosion, electro-migration, or foreign particles

• Identify resistive opens caused by interface contamination at via interconnects

• Pinpoint location for direct TEM lamella FIB preparation 

Characterize interconnects with highest resolution
 

• Reveal electrical integrity of nets with sub-mciron lateral resolution and bridge from EFA to PFA

• Diagnose fabrication and long term issues, including contamination,metal pattering defects, resistive interconnectors, or electro-migration

• Directly isolate defects to the exact layer and die location, and improve them to product improvement actions
   

Verify device operation modes with built-in biasing for voltage contrast

• Image bias/voltage contrast in delayered devices

• Monitor operation of devices under bias

• Compare imaged behaviour with device design

Localize defects in thin dielectric layers 

• Visualise and localise weaknesses in gate oxide (GOX) and capacitor oxide (COX) before breakdown

• Pinpoint oxides shorts caused by ESD or EOS with sub-micron resolution

• Preserve the original defect signature with power dissipation in the lower nW range during localization

Access failures invisible in voltage contrast

• Find low resistances that allow charge tunneling trough the interconnects

• Investigate structures in contact with the silicon substrate

• Characterize large metal structures

裕隆時代擁有一支涉及眾多領(lǐng)域高素質(zhì)的應(yīng)用支持團隊，向客戶提供完整的實驗室解決方案和良好的售后服務(wù)。


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裕隆時代，愿和您一起攜手，共創(chuàng)美好未來！